Still troubled by uneven heat dissipation and weak bonding of electronic devices? IOTA 69316 condensation-type one-component thermal conductive adhesive material makes a grand debut, safeguarding the stable operation of devices with its high-performance capabilities!
As a high-quality product made of silicone, it combines the dual advantages of thermal conductivity and bonding. With a thermal conductivity of 0.82W/m.K, it can quickly conduct heat and solve the heat dissipation problem of electronic components. The one-component neutral dealcoholization formula is gentler, and with titanium catalysis, it cures by absorbing moisture, enabling convenient and efficient operation.
In a white semi-fluid state, it has a density of 1.65g/cm³, a surface drying time of only 2-4 minutes, and a hardness of 50±5 Shore, adapting to various scenario requirements. Whether it's LED lamp sealing, heat dissipation of automotive electronic components, positioning and sealing of PCB boards, or gap filling between high-power triodes, thyristor diodes and substrates (aluminum, copper), it can be accurately adapted, achieving firm bonding while efficiently dissipating heat.
IOTA 69316 protects electronic devices with reliable performance, making heat dissipation and bonding a one-step process, and becoming a worry-free choice in industrial production!