Amid the trend of electronic devices becoming smaller and more high-powered, the dual challenges of heat dissipation and bonding have emerged as industry pain points. The IOTA-69317 condensation-type one-component thermal conductive adhesive material makes its debut, resolving production dilemmas with all-around performance! This paste-like material combines high thermal conductivity ceramic fillers with a high-quality silicone matrix. Boasting excellent thermal conductivity, it rapidly establishes dense heat transfer channels, effectively reducing the temperature rise of core components such as CPUs and power devices. Its one-component design eliminates the need for mixing, enabling easy application via manual or automated dispensing. It adapts to mass production rhythms, significantly boosting assembly efficiency. It integrates strong adhesion with high elasticity, firmly filling the uneven gaps between components and heat sinks to eliminate vibration stress. Once cured, it does not flow or settle, maintaining reliable bonding over long-term use. With a wide temperature resistance range of -50℃~200℃, UL94 V-0 flame retardant rating, and breakdown voltage of ≥15kV/mm, it performs stably in harsh environments such as automotive electronics, 5G base stations, and power batteries. From consumer electronics to industrial equipment, IOTA-69317 leverages the three-in-one advantage of "thermal conductivity + bonding + insulation," delivering more efficient heat dissipation and easier installation. It has become the preferred thermal interface material for intelligent manufacturing upgrades!