Still troubled by poor heat dissipation and weak bonding of electronic components? IOTA 69320 Condensation-Curing One-Component Thermal Conductive Adhesive is here, integrating thermal conductivity and bonding functions to safeguard electronic devices in multiple scenarios!
This silicone thermal conductive adhesive delivers outstanding performance. With a thermal conductivity of 2.03W/m.K, it efficiently transfers heat. Its high-density paste (2.75g/cm³) easily fills gaps between components and substrates. Featuring fast surface drying in 6-12 minutes and a hardness of 75±5 Shore, it bonds firmly without peeling after curing. The one-component neutral dealcoholization formula, combined with titanium catalysis, ensures environmental friendliness and safety.
From LED lighting sealing and automotive electronics heat dissipation to PCB board positioning and gap filling for high-power triodes and thyristor diodes, it adapts to various substrates like aluminum and copper. It comprehensively solves the pain points of uneven heat dissipation and poor sealing in electronic devices. The one-component design allows ready-to-use operation without complex processes, boosting production and assembly efficiency.
Whether for industrial electronics or automotive parts, IOTA 69320 guarantees long-term stable operation of devices with reliable performance, making it the preferred thermal conductive bonding solution for the electronics industry!