Still struggling with heat dissipation and bonding challenges for electronic components? Look no further than IOTA 69337 condensation-cure one-component thermal conductive adhesive material. It stands out as the top choice across multiple fields with its outstanding performance. This material comes in a white paste form, with a density of 1.65g/cm³ and a surface drying time of only 10-20 minutes. After curing, it reaches a hardness of 70±5 Shore, ensuring easy operation and stable forming. Catalyzed by titanium, it is a formic acid-releasing silicone adhesive with a thermal conductivity of up to 0.81W/m.K. It efficiently transfers heat while providing reliable bonding and sealing effects. From LED lighting sealing and automotive electronic component heat dissipation to PCB board positioning/sealing and gap filling for high-power triodes and thyristor diodes (with substrates like aluminum and copper), it excels in every scenario. Whether for bonding aluminum, copper, or other substrates, or for heat dissipation protection of electronic components, it delivers consistent performance, safeguarding the long-term operation of equipment. High-efficiency thermal conductivity + strong bonding + easy construction – IOTA 69337 simplifies heat dissipation and bonding for electronic devices, making it an indispensable practical tool in industrial production!