Still struggling to balance thermal conductivity and firm adhesion for electronic components? Introducing IOTA 69445 Addition-Cure One-Component Thermally Conductive Adhesive Material – a one-stop solution for diverse application needs! Featuring dual-process design of stencil printing and dispensing, it offers flexible and convenient operation. With a thermal conductivity of 2.5W/m·k and low thermal resistance change rate, it rapidly dissipates heat from components to ensure stable device operation. It achieves fast curing at 150℃ in just 30 minutes, boasting a Shore A hardness of 75±5 that combines toughness and support. The shear strength of 2.2MPa on Al/Al substrates guarantees robust bonding. In a gray microfluid state, it boasts wide adaptability – easily handling scenarios like bonding plastic housings and aluminum plates for automotive electronics, thermally conductive fixation of MOSFETs, lamination of heating elements, wafer fixing, and casing sealing. Its low BLT (Bond Line Thickness) characteristic paired with excellent adhesion performance balances efficient construction and long-term durability, providing reliable support for electronic component assembly.