Troubled by poor heat dissipation or weak bonding of automotive electronic components? Loose fit of heating elements or inadequate sealing? IOTA 69550 addition-cure one-component thermally conductive adhesive is here to help. Integrating thermal conductivity, bonding and sealing, it’s tailored for precision electronic applications.
Featuring a one-component design, it supports stencil printing and dispensing for easy and efficient operation. It cures quickly at 150℃ in just 30 minutes to form a strong bond, with a thermal conductivity of 2.2 W/m·k and low thermal resistance change rate for stable heat dissipation. With a density of 2.65 g/cm³ and a semi-thixotropic fluid state, it adapts to complex fitting needs. Boasting a hardness of 75±10 Shore A (balancing toughness and support) and an Al/Al shear strength of 3.2 MPa, it bonds firmly without easy detachment.
It precisely fits various scenarios: bonding of plastic housings and aluminum plates in automotive electronics, thermal conductive fixing of MOSFETs and heating devices, lamination of heating elements, fixing and bonding of wafers, and bonding/sealing of casings. Its low BLT characteristic suits precision assembly, while the flexible design copes with operational vibrations, ensuring stable performance of electronic components in complex environments.
With core advantages of efficient thermal conductivity, strong bonding and multi-process adaptability, IOTA 69550 is a reliable choice for automotive electronics and precision devices, easily solving thermal conductive bonding challenges!