Still troubled by bonding challenges in high-temperature environments? The IOTA H21400 borosilazane adhesive is here to solve bonding pain points under extreme working conditions with outstanding performance! This solvent-free adhesive features a two-component gray design, free of unnecessary additives, offering environmental friendliness and reliability. With a viscosity of 3000~4000 cPs, it adapts to various construction scenarios, easily handling bonding and sealing between metals, ceramics, and composite materials, as well as the preparation of high-temperature resistant coatings. Its core strength of withstanding 1300-1500℃ is a benchmark in the industry. The lap shear strength remains above 8MPa from room temperature to 1000℃, and still maintains over 2MPa even at 1500℃, delivering unbeatable stability in high-temperature environments. Curing at a moderate temperature of 170℃ takes only 2 hours, followed by furnace cooling for molding—far more efficient than traditional products. Multiple packaging options (0.5L~10L) are available to meet different needs, with a 1-year shelf life when stored in a sealed, cool and dry place. A friendly reminder: it’s recommended to use it in a well-ventilated area to avoid the impact of ammonia gas emitted from the base adhesive after long-term storage. Whether for component bonding under harsh working conditions or high-temperature resistant coating preparation, IOTA H21400 can handle it steadily, making it a reliable partner in industrial production!