Uniform stress distribution (avoiding stress concentration)
No damage to the substrate (eliminating holes, preventing thermal damage, and maintaining protective coatings)
Weight reduction (thinner metal substrates can be used)
Labor reduction (no need for drilling or grinding welds)
Simultaneous bonding and sealing
Reduced galvanic corrosion
Bonding of dissimilar materials
Improved appearance and enabling unique designs
Sound insulation and vibration damping
Possessing certain flexibility, especially compared with mechanical connection methods