Solve the Dilemma of Electronic Heat Dissipation and Bonding, IOTA 68210 Safeguards the Stable Operation of Equipment
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Against the backdrop of the rapid development of industries such as automotive electronics, photovoltaic energy, and new energy vehicles, the stable operation of core components like electronic modules, sensor devices, and lithium battery packs relies increasingly on efficient heat dissipation and reliable bonding technologies. However, traditional thermal conductive bonding materials often face issues such as high viscosity, difficult operation, slow heat dissipation, and long curing time. These problems not only affect production efficiency but also may lead to equipment failures due to inadequate heat dissipation. At this point, the emergence of IOTA 68210 Addition-Curing Two-Component Thermal Conductive Bonding Material precisely provides a practical solution to these industry pain points.
In terms of application fields, IOTA 68210 has wide adaptability and can meet the core needs of multiple popular industries. It is mixed and used in a 1:1 ratio, featuring simple and easy proportioning operation. No complex metering equipment is required, which reduces the error risk in the production process. In the field of automotive electronics, it can be used for the potting and bonding of automotive electronic modules and new energy vehicle OBC (On-Board Charger) modules, providing dual protection of heat dissipation and fixation for automotive electronic components. In the photovoltaic industry, it is suitable for the packaging needs of photovoltaic junction boxes and inverters, helping photovoltaic equipment operate stably in complex outdoor environments. In the field of new energy vehicles, it is even an ideal choice for the potting and bonding of lithium battery packs. It can effectively solve the heat dissipation problem of lithium batteries during operation and improve the safety and service life of battery packs. Additionally, in the production of various sensor devices, it can also exert excellent bonding and heat dissipation effects, ensuring the accurate detection and long-term operation of sensors.