IOTA 69550 is an addition-curing one-component thermal conductive bonding material, featuring convenient operation with support for stencil printing and dispensing.
It has a low BLT value, excellent bonding performance, and fast curing speed – it can cure and form bonds in 30 minutes at 150°C. Meanwhile, it has a low thermal resistance change rate and good flexibility, ensuring stable performance in use.
In terms of technical indicators, its thermal conductivity is 2.2 W/m·k, and it is in a semi-thixotropic fluid state with a density of 2.65 g/cm³. After curing, its hardness (Shore A) is 75±10, and the shear strength between aluminum and aluminum reaches 3.2 MPa.
It has a wide range of applications, including bonding between plastic shells and aluminum plates of automotive electronic devices, thermal conductive bonding and fixing of heating devices or MOS tubes, bonding of heating elements, fixing and bonding of wafers, as well as bonding and sealing of casings, etc.