Electronic Component Encapsulation: In the field of electronic component encapsulation, epoxy resin curing agents play a vital and essential role. Electronic components such as integrated circuits (ICs), transistors, and diodes need to be encapsulated to protect them from the erosion of the external environment and ensure stable performance. Anhydride curing agents, such as phthalic anhydride and maleic anhydride, are often used in this scenario. After reacting with the epoxy resin, they can form cured products with excellent electrical insulation properties, high heat resistance, and mechanical strength. Taking IC encapsulation as an example, the epoxy resin encapsulation material cured by the anhydride curing agent can effectively block impurities such as moisture and dust, ensure the normal operation of the internal circuits of the IC, and at the same time, it can withstand a certain amount of heat generated during the operation of the electronic components, ensuring long-term reliability.

Circuit Board Potting: The purpose of circuit board potting is to improve the moisture-proof, dust-proof, and anti-corrosion properties of the circuit board, and enhance its mechanical strength and electrical insulation performance. Aliphatic amine curing agents, such as ethylenediamine and diethylenetriamine, are widely used in circuit board potting due to their fast curing speed and high bonding strength. When mixed with the epoxy resin, they can quickly cure to form a hard protective coating, effectively filling the gaps and holes of the circuit board, protecting the electronic circuits, preventing short-circuit failures caused by moisture, dust, etc., and extending the service life of the circuit board. For example, in the circuit board of the automotive electronic control system, the epoxy resin potting material cured by the aliphatic amine curing agent can ensure the stable operation of the circuit board in the complex automotive environment.