The condensation-type two-component silicone thermal conductive adhesive mainly consists of two components: the base polymer and the curing agent. The base polymer is usually a polysiloxane containing reactive groups such as hydroxyl and methoxy groups, while the curing agent contains silane compounds or other crosslinking agents that can undergo a condensation reaction with these reactive groups. When the two components are mixed, the reactive groups undergo a condensation reaction to form a three-dimensional cross-linked network structure, thus achieving the curing of the adhesive. This cross-linking reaction process is accompanied by the generation of small-molecule by-products (such as water, alcohol, etc.). Compared with the addition reaction, although it is slightly more complex, it endows the adhesive with some unique performance advantages.

Excellent Performance Highlights Industry Value

(I) Outstanding Thermal Conductivity

In fields with extremely high requirements for heat dissipation, such as electronic devices and new energy vehicles, the condensation-type two-component silicone thermal conductive adhesive shows powerful thermal conductivity. By adding highly thermally conductive fillers, such as alumina and boron nitride, to the base polymer, the adhesive can construct an efficient heat conduction path and quickly transfer heat from the heat source. Its thermal conductivity coefficient can generally reach 1.0 - 3.0W/(m·K), effectively ensuring the stable operation of equipment in high-temperature environments and preventing performance degradation and failures caused by overheating.

(II) Reliable Bonding Strength

This adhesive can achieve firm bonding for a variety of materials, including metals, ceramics, glass, plastics, etc. During the curing process, polysiloxane molecules are closely combined with the surface of the adherend through the dual effects of chemical bonding and physical adsorption, forming a strong adhesion force. Even under harsh working conditions such as large mechanical stress, temperature changes, and chemical corrosion, the bonding joint can still remain stable, providing a solid guarantee for the structural integrity of the product.

(III) Good Weather Resistance and Chemical Stability

Silicone materials themselves have excellent weather resistance, and the condensation-type two-component silicone thermal conductive adhesive is no exception. Whether it is exposed to the outdoor environment of ultraviolet rays, ozone, high and low temperature cycles for a long time, or in the erosion of chemical media such as acids, alkalis, and organic solvents, the adhesive can maintain stable performance and is not prone to phenomena such as aging, degradation, and peeling. This makes it widely used in fields with extremely high requirements for material durability, such as outdoor facilities, chemical equipment, and aerospace.

(IV) Flexible Operation Time and Curing Speed

Different from one-component adhesives, when using the condensation-type two-component adhesive, users can flexibly adjust the mixing ratio of the two components and the curing conditions according to actual needs, thereby controlling the operation time and curing speed of the adhesive. In cases where large-area construction or bonding of complex structures is required, the operation time can be appropriately extended to ensure that the adhesive can fully fill and wet the surface of the adherend; while in cases where high production efficiency is required, the curing speed can be accelerated by adjusting the amount of the curing agent or increasing the curing temperature, shortening the production cycle.
IOTA 69322 condensation two-component thermally conductive adhesive material-Silicone Adhesive
IOTA 68130 condensation two-component thermally conductive adhesive material-Silicone Adhesive