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The Applications and Preparation Process of Addition-Cure One-Component Silicone Thermal Conductive Adhesive Materials

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Diverse Applications Empower the Upgrading of High-End Manufacturing

(I) The Electronic Information Industry Promotes the Miniaturization and High-Performance of Equipment

In portable electronic devices such as smartphones and tablets, the efficient connection between the chip and the heat dissipation module is of crucial importance. The addition-cure one-component silicone thermal conductive adhesive, with its excellent thermal conductivity and bonding performance, achieves efficient heat dissipation in a compact space, helping the equipment to maintain strong computing performance while being thin and light. In large electronic devices such as 5G base stations and data centers, its excellent reliability and stability ensure the long-term stable operation of the equipment, providing a solid support for the high-speed development of information and communication.

(II) The New Energy Vehicle Industry Helps Optimize and Upgrade the Power System

Core components such as battery modules and motor controllers in new energy vehicles generate a large amount of heat during operation. This adhesive is used for key parts such as the bonding of battery cells and heat sinks, and the fixation of motor stators and casings. It can not only effectively conduct heat to ensure the efficient operation of the battery and motor, but also maintain reliable bonding under complex vibrations, high and low temperatures and other working conditions, improving the safety and durability of the power system and promoting the technological progress of the new energy vehicle industry.

(III) The Aerospace Field Meets the Stringent Requirements of Extreme Environments

Aerospace equipment operates in harsh environments such as high altitude, high speed, and extreme temperatures, and has almost demanding requirements for material performance. The addition-cure one-component silicone thermal conductive adhesive, with its excellent thermal stability, lightweight advantage, and outstanding reliability in extreme environments, is widely used in key links such as the installation of electronic equipment and the bonding of structural components of aircraft. It provides an indispensable guarantee for the high-performance and high-reliability operation of aerospace equipment, helping humans to explore a broader cosmic space.

Preparation Process 

(I) Selection and Pretreatment of Raw Materials

To ensure the high quality of the adhesive, raw materials such as vinyl-containing polysiloxane, hydrogen-containing polysiloxane, and catalysts are strictly selected and finely pretreated. By precisely controlling the molecular weight distribution, functional group content, and impurity content of the raw materials, the consistency and stability of the adhesive performance are guaranteed from the source.

(II) Precise Ratio and Mixing Process

During the preparation process, high-precision metering equipment is used to strictly control the ratio of each component. Advanced mixing technologies such as high-speed stirring and ultrasonic dispersion are adopted to ensure that all components are uniformly mixed to form a stable colloidal system. Precise ratio and efficient mixing process are key links to achieve the excellent performance of the adhesive.

(III) Optimization of Curing Conditions and Quality Inspection

According to different application scenarios and product requirements, the curing conditions of the adhesive are precisely optimized, including the regulation of parameters such as temperature, time, and pressure. At the same time, a complete quality inspection system is established, and a variety of advanced detection methods such as thermogravimetric analysis, infrared spectroscopy, and tensile testing are used to strictly detect the key performance indicators of the adhesive, such as thermal conductivity, bonding strength, and weather resistance, to ensure that each batch of products meets high-quality standards. The addition-cure one-component silicone thermal conductive adhesive, with its unique chemical composition, excellent performance, and wide application fields, is becoming an important force promoting the high-end and intelligent development of modern industry. With the continuous innovation of science and technology and the continuous improvement of processes, it will surely show great application potential in more emerging fields and inject a continuous stream of vitality into the transformation and upgrading of the global manufacturing industry.

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