In many industrial fields with strict requirements for material performance, the IOTA 69337 condensation one - component thermal conductive bonding material, with its excellent performance, has become a powerful assistant in solving heat dissipation and bonding problems. This material has remarkable product characteristics. It is a one - component neutral alcohol - releasing type with a thermal conductivity of up to 0.8 W/(m·K), which can efficiently conduct heat and provide good heat dissipation protection for various heat - generating components. It adopts a moisture - curing method, is in a paste state, and reaches the V - 0 flame - retardant grade. While ensuring safe use, it is convenient for construction and operation. As an organic silicon thermal conductive bonding adhesive, it has excellent stability and adaptability. In terms of technical indicators, the IOTA 69337 appears as a white paste with a uniform and delicate appearance. Its density is 1.65 g/cm³, ensuring the material's compactness. The surface - drying time is only 10 - 20 minutes, which can quickly form an initial setting and improve production efficiency. The hardness reaches shore 70±5, with good mechanical strength. The actual thermal conductivity is 0.81 W/(m·k), slightly higher than the nominal value, resulting in better heat dissipation performance. Its formic - acid - releasing type and titanium - catalyzed characteristics further ensure the stability and reliability of the product. In terms of application fields, the IOTA 69337 has a wide range of uses. In the sealing of LED lamps, it can effectively block external moisture and impurities and help the lamps dissipate heat, thus extending their service life. For the heat dissipation of automotive electronic components, it can quickly transfer heat, ensuring the stable operation of electronic devices in complex environments. In the heat dissipation, positioning, and sealing of PCB boards and electronic components, it can achieve accurate positioning and efficient heat dissipation. For the filling of gaps between high - power triodes, thyristor - element diodes and substrates (aluminum, copper), it can closely adhere and fill the gaps, improving the heat dissipation effect and connection stability. Choose the IOTA 69337 to provide a high - quality solution for your heat dissipation and bonding needs.
IOTA 69337 condensation one-component thermally conductive adhesive material-Silicone Adhesive