In the fields of electronic devices and automotive electronics, the performance requirements for thermal conductive and bonding materials are becoming increasingly stringent. The IOTA 69445 addition-curing one-component thermal conductive bonding material has emerged as an ideal choice for numerous application scenarios due to its outstanding characteristics.
The IOTA 69445 boasts multiple advantageous features. It supports both stencil printing and dispensing processes, offering flexible and convenient operation to meet different production needs. Its low BLT characteristic ensures excellent performance during use. This material exhibits excellent bonding performance, enabling it to firmly connect different components. It excels in rapid curing, forming a reliable bond in just 30 minutes at 150°C, which significantly enhances production efficiency. The low thermal resistance change rate guarantees long-term stable thermal conductivity, while its flexibility allows it to adapt to different working environments and stress variations.
In terms of technical specifications, it has a thermal conductivity of 2.5 W/(m·K), enabling efficient heat transfer. It appears as a gray microfluid with a density of 3.0 g/cm³. The curing time is 30 minutes at 150°C, the hardness (Shore A) is 75 ± 5, and the shear strength (MPa, Al/Al) reaches 2.2. All performance indicators are well-balanced and excellent.
In the application domain, the IOTA 69445 is widely applicable in multiple scenarios. In automotive electronic devices, it can be used for bonding plastic shells to aluminum plates, ensuring the stability of components. For heat-generating devices or MOS transistors, it can achieve thermal conductive bonding and fixation, effectively dissipating heat and extending the service life of the devices. It can also be used for the bonding of heating elements and the fixation and bonding of wafers, ensuring precise positioning and good heat conduction. Additionally, it plays an important role in the bonding and sealing of casings, providing reliable protection. With its reliable performance and wide applicability, the IOTA 69445 addition-curing one-component thermal conductive bonding material offers a high-quality solution for the thermal management and bonding needs of various industries.
IOTA 69445 addition type one-component thermally conductive adhesive material-Silicone Adhesive
