1. Silicone Potting Adhesive

Most silicone electronic potting adhesives are soft and elastic after curing and can be repaired, simply referred to as soft glue, with relatively poor adhesion. Their colors can generally be adjusted as required, either transparent, non - transparent, or colored. Two - component silicone potting adhesives are the most common, and this type of glue includes two categories: condensation - type and addition - type. Generally, the condensation - type has poor adhesion to components and the potting cavity, and volatile low - molecular substances are generated during the curing process, with a relatively obvious shrinkage rate after curing. The addition - type (also known as silicone gel) has a minimal shrinkage rate, does not generate volatile low - molecular substances during the curing process, and can be rapidly cured by heating. Advantages:

• It has strong anti - aging ability, good weather resistance, and excellent impact resistance.
• It has excellent resistance to thermal changes and good thermal conductivity, and can be used within a wide operating temperature range. It can maintain elasticity and not crack within the temperature range of - 60°C to 200°C, and can be used at 250°C for a long time. The heat - cured type has an even higher temperature resistance. It has excellent electrical properties and insulation capabilities, with better insulation performance than epoxy resin, and can withstand a voltage of over 10,000V. After potting, it effectively improves the insulation between internal components and circuits, enhancing the operational stability of electronic components.
• It is non - corrosive to electronic components and does not produce any by - products during the curing reaction.
• It has excellent reworkability, allowing components to be quickly and easily removed for repair and replacement after sealing.
• It has excellent thermal conductivity and flame - retardant capabilities, effectively improving the heat dissipation capacity and safety factor of electronic components.
• It has a low viscosity and good fluidity, enabling it to penetrate into small gaps and under components.
• It can be cured at room temperature or by heating, has good self - defoaming properties, and is more convenient to use.
• It has a small curing shrinkage rate, and excellent waterproof and shock - resistant capabilities.

Disadvantages: Poor adhesion. Scope of Application: It is suitable for potting various electronic components that work in harsh environments.