I. What is Potting?

Potting (gluing) refers to the process of filling polyurethane potting adhesive, silicone potting adhesive, or epoxy resin potting adhesive into devices containing electronic components and circuits, either by equipment or manually. Under normal temperature or heating conditions, it cures into a high - performance thermosetting polymer insulating material, achieving the purposes of bonding, sealing, potting, and coating protection.

II. What are the Main Functions of Potting?

The main functions of potting are as follows:

1. Strengthen the integrity of electronic devices, improving their resistance to external impacts and vibrations.
2. Enhance the insulation between internal components and circuits, facilitating the miniaturization and lightweighting of devices.
3. Prevent the direct exposure of components and circuits, improving the device's waterproof, dust - proof, and moisture - proof performance.
4. Conduct heat.

III. What are the Advantages and Disadvantages of the Three Types of Potting Adhesives?

1. Epoxy Resin Potting Adhesive Epoxy resin potting adhesives are mostly rigid. After curing, they are as hard as stone and difficult to remove, which provides good confidentiality. However, there are also a small number of soft - type ones. The general temperature resistance is around 100°C, and for those cured by heating, the temperature resistance is around 150°C. There are also some with a temperature resistance above 300°C. It has the characteristics of fixation, insulation, waterproofing, oil - proofing, dust - proofing, confidentiality, corrosion resistance, aging resistance, and resistance to thermal shock. Common types of epoxy potting adhesives include flame - retardant type, heat - conductive type, low - viscosity type, and high - temperature - resistant type.

• Advantages: It has a good adhesion to hard materials, excellent high - temperature resistance and electrical insulation capabilities. It is easy to operate, very stable both before and after curing, and has excellent adhesion to various metal substrates and porous substrates.
• Disadvantages: It has a weak ability to resist changes in temperature. It is prone to cracking when subjected to thermal shock, allowing water vapor to penetrate into the electronic components through the cracks, resulting in poor moisture - proof performance. After curing, the colloid is relatively hard and brittle, which may easily damage the electronic components. Once potted, it cannot be opened, and the repairability is poor.
• Scope of Application: Epoxy resin potting adhesive can easily penetrate into the gaps of products. It is suitable for potting small - and medium - sized electronic components under normal temperature conditions and with no special requirements for environmental mechanical properties, such as automotive and motorcycle igniters, LED drive power supplies, sensors, toroidal transformers, capacitors, triggers, LED waterproof lights, and for the confidentiality, insulation, and moisture - proof (water - proof) potting of circuit boards.
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