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Organosilicon Thermally Conductive Adhesive Materials: In - Depth Analysis of Addition - Type, Condensation - Type, One - Component, and Two - Component(3)

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One - Component and Two - Component Organosilicon Thermally Conductive Adhesive Materials Packaging and Usage Methods One - Component: All components of one - component organosilicon thermally conductive adhesive materials are pre - mixed in a single package. During use, it only needs to be applied directly through methods such as extrusion or dispensing. This packaging form is convenient for storage and transportation. There is no need for on - site mixing during use, and the operation is simple and quick. It is suitable for scenarios such as small - scale production and on - site maintenance. Two - Component: Two - component organosilicon thermally conductive adhesive materials are packaged separately for the base material and the curing agent. Before use, they need to be mixed evenly in a certain proportion. Although the mixing process is relatively complex, two - component materials can flexibly adjust the formula ratio according to actual needs to obtain different performances and meet diverse application requirements.
Silicone thermal conductive adhesive-Products-Silicone Adhesive

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