Performance Characteristics

• Addition - type: It features excellent heat resistance and weather resistance, capable of maintaining stable performance within a wide temperature range (-50°C - 200°C or even higher). It has a fast curing speed, and the curing time can be precisely controlled by adjusting the amount of catalyst and the reaction temperature, making it suitable for automated production processes. In addition, the addition - type material has good electrical insulation properties and no corrosive effect on electronic components, which is highly suitable for applications in the electronics field.
• Condensation - type: The curing process is relatively simple, with low requirements for curing conditions. It can cure at room temperature, which is quite convenient for operation. It has a relatively low cost and has advantages in some application scenarios where cost - sensitivity is high and performance requirements are not extremely stringent. However, the heat resistance and weather resistance of the condensation - type material are slightly inferior to those of the addition - type. Long - term use in high - temperature environments may lead to a decline in performance.

Application Scenarios

• Addition - type: It is widely used in fields with extremely high requirements for precision and reliability, such as semiconductor packaging, LED lighting, 5G communication equipment, etc. In semiconductor packaging, the addition - type organosilicon thermally conductive adhesive material can ensure a tight connection between the chip and the heat sink, efficiently conduct heat, and at the same time, guarantee the stability of the packaging structure, preventing stress damage caused by temperature changes.
• Condensation - type: It is commonly used in general industrial manufacturing, building sealing, and the assembly of some consumer electronic products. For example, in the construction field, the condensation - type organosilicon thermally conductive sealant can be used for door and window sealing, curtain wall joint filling, etc. of buildings. It can not only play a role in sealing and waterproofing but also conduct heat to a certain extent, regulating the indoor temperature.Silicone thermal conductive adhesive-Products-Silicone Adhesive
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