In today's era of continuous development in materials science, organosilicon thermally conductive adhesive materials have been widely applied in numerous fields such as electronics, automobiles, and aerospace, thanks to their excellent thermal conductivity and adhesive capabilities. Depending on the curing mechanism and packaging form, organosilicon thermally conductive adhesive materials are mainly classified into addition - type and condensation - type, as well as one - component and two - component. A deep understanding of their characteristics is crucial for the correct selection and application of these materials. Addition - type and Condensation - type Organosilicon Thermally Conductive Adhesive Materials Curing Principles Addition - type: The curing of addition - type organosilicon thermally conductive adhesive materials is based on the hydrosilylation reaction. Under the action of a platinum catalyst, the vinyl - containing polysiloxane reacts with the hydrogen - containing polysiloxane through an addition reaction to form a cross - linked network structure, thus achieving curing. During this reaction process, no small - molecule by - products are generated, enabling the addition - type material to have an extremely small volume shrinkage rate during curing and maintain good dimensional stability. Condensation - type: The curing of condensation - type organosilicon thermally conductive adhesive materials is achieved through a condensation reaction. Usually, a polysiloxane containing active groups (such as hydroxyl groups, alkoxy groups, etc.) reacts with a curing agent (such as organotin compounds, etc.). During the reaction, small - molecule by - products (such as water, alcohol, etc.) are generated. Due to the escape of these small molecules, the condensation - type material will experience a certain degree of volume shrinkage during curing. Silicone thermal conductive adhesive-Products-Silicone Adhesive