IOTA 69550 boasts numerous remarkable product features. In terms of process adaptability, it supports both stencil printing and dispensing. Whether it is for precise glue application in large - scale production or for small - batch and high - precision product manufacturing, it can handle tasks with ease, providing great flexibility to enterprises' production processes. Its low BLT feature effectively ensures the material's stability in various complex environments, making the product's performance more reliable. In terms of bonding performance, IOTA 69550 performs outstandingly, capable of forming a firm connection between different materials, ensuring the structural integrity of the product. Rapid curing is also a major highlight. It can complete curing and form a bond in just 30 minutes at 150°C, significantly shortening the production cycle and improving production efficiency, which is of great significance for modern industries that pursue high - efficiency production. In addition, its low thermal resistance change rate enables it to conduct heat stably, playing a key role in the heat dissipation applications of heat - generating devices. Its flexibility allows it to adapt to surfaces of different shapes and materials, reducing material damage caused by stress concentration. Looking at the technical indicators, IOTA 69550 also stands out. Its thermal conductivity reaches 2.2 W/m·K, enabling it to transfer heat efficiently and providing an effective solution to the heat - dissipation challenges of electronic devices. It is in a semi - thixotropic fluid state, facilitating operation and construction. During the production process, it can be easily applied and filled. With a density of 2.65 g/cm³, it ensures the stability and reliability of the material. The curing time is 30 minutes at 150°C, echoing its rapid - curing feature. The hardness is shore A 75 ± 10, which, while ensuring a certain strength, also has a certain degree of flexibility to adapt to different usage scenarios. The shear strength (MPa, Al/Al) reaches 3.2, demonstrating its strong bonding ability to withstand a certain amount of external force. In terms of application areas, IOTA 69550 shines brightly. In the automotive electronics field, it can be used for bonding the plastic shells of automotive electronic devices to aluminum plates, ensuring the stable operation of electronic devices in the complex automotive operating environment. For the thermal bonding and fixation of heat - generating devices or MOS tubes, it can effectively solve the dual challenges of heat dissipation and fixation, improving the performance and reliability of electronic equipment. In semiconductor manufacturing, it is indispensable for the bonding of heating elements and the fixation of wafers, ensuring the normal production and operation of precision components such as chips. In the bonding and sealing of various types of casings, it can also perform outstandingly, providing reliable sealing and protection. The debut of the IOTA 69550 addition - type one - component thermally conductive adhesive injects new vitality into the industrial manufacturing industry. With its excellent product features, outstanding technical indicators, and wide application areas, it is expected to promote technological progress and product upgrades in related industries, meet the market's demand for high - performance adhesive materials, and play an important role in future industrial manufacturing.
IOTA 69550 addition one-component thermally conductive adhesive material-Silicone Adhesive