I. Definition and Purpose

Thermally Conductive Adhesive

• Definition: Thermally conductive adhesive is a type of polymer colloidal material that not only bonds the surfaces of two materials together but also possesses multiple functions such as thermal conductivity, insulation, and sealing.
• Purpose: It is primarily used for gap-filling and bonding between high-performance chips, high-power transistors, thermistors, temperature sensors, and power supply modules (such as copper and aluminum radiators) of high-power electrical appliances to enhance heat dissipation.

Thermally Conductive Agent

• Definition: A thermally conductive agent is a liquid or gaseous substance used to improve the thermal conductivity between materials.
• Purpose: Thermally conductive agents are commonly used in various applications requiring enhanced thermal conductivity, such as industrial cooling systems and heat exchangers.

II. Performance Characteristics

Thermally Conductive Adhesive

• Thermal Conductivity: The thermal conductivity of thermally conductive adhesive generally ranges from 0.6 to 2.0 W/mK, with specific values depending on its formulation and manufacturing process.
• Adhesive Strength: Thermally conductive adhesive exhibits strong adhesive strength, ensuring a stable connection between objects.
• Temperature Range: It can maintain stable performance in environments ranging from -50°C to 200°C for long-term operation.
• Insulation and Sealing: It possesses excellent insulation and sealing properties, effectively preventing electrical short circuits and the ingress of moisture, dust, and other impurities.
• Aging Resistance and Shock Resistance: It demonstrates outstanding resistance to temperature cycling, aging, and shock.

Thermally Conductive Agent

• Thermal Conductivity: The primary function of a thermally conductive agent is to improve thermal conductivity, with specific performance depending on its type and concentration.
• Fluidity: Thermally conductive agents typically have good fluidity to ensure uniform distribution in the medium requiring heat transfer.
• Stability: Thermally conductive agents need to maintain stable performance under various operating conditions to ensure continuous and effective thermal conduction.

III. Application Scenarios

Thermally Conductive Adhesive

• Electronic Components: Used for heat dissipation bonding of high-performance chips, high-power transistors, and other electronic components.
• LED Lighting: Used for thermally conductive bonding of high-power LED components, LED display backlight tubes, and other LED lighting products.
• Power Modules: Used for thermally conductive bonding applications in power supplies and power devices for photovoltaics, electric vehicles, machinery, etc.
• Radiator Fixation: Used for heat dissipation bonding between CPU radiators, thyristors, wafers, and heat sinks.

Thermally Conductive Agent

• Industrial Cooling Systems: Used to improve the thermal conductivity of coolant, thereby enhancing cooling efficiency.
• Heat Exchangers: Used to enhance thermal conductivity in heat exchangers, improving heat exchange efficiency.
• Other Applications Requiring Enhanced Thermal Conductivity: Such as solar thermal systems, geothermal power generation systems, etc.

In summary, thermally conductive adhesive and thermally conductive agent differ significantly in terms of definition, performance characteristics, and application scenarios. Thermally conductive adhesive is primarily used for bonding and thermal conductivity, while thermally conductive agent is mainly used to improve thermal conductivity. When selecting which material to use, comprehensive consideration should be given based on specific application scenarios and requirements.