Thermally Conductive Adhesive is a type of polymeric colloidal material primarily used for bonding the surfaces of two materials. It possesses multiple functions such as thermal conductivity, insulation, and sealing.

Characteristics:

1. Adhesion and Thermal Conductivity: Thermally Conductive Adhesive not only exhibits strong adhesive strength, ensuring a stable connection between objects, but also has certain thermal conductivity, aiding in heat dissipation. However, achieving both thermal conductivity and adhesive strength can be challenging, as thermally conductive fillers may impact adhesive performance, resulting in a thermal conductivity rate generally ranging from 0.6 to 2.0 W/mK.

2. Wide Temperature Range: Thermally Conductive Adhesive can maintain stable performance in environments ranging from -50°C to 200°C, suitable for various high or low-temperature working conditions.

3. Insulation and Sealing: Thermally Conductive Adhesive also demonstrates excellent insulation and sealing properties, effectively preventing electrical short circuits and the ingress of moisture, dust, and other impurities, thereby enhancing the reliability and service life of equipment.

4. Aging Resistance and Shock Resistance: Thermally Conductive Adhesive exhibits remarkable resistance to temperature cycling, aging, and shock, capable of adapting to various harsh working environments while maintaining stable adhesion and thermal conductivity.

5. Ease of Operation: Thermally Conductive Adhesive cures rapidly, is easy to extrude, and facilitates convenient operation. It is suitable for various manual or mechanical dispensing methods, meeting the needs of various working environments and conditions.

Scope of Application

1. Electronic Components: Thermally Conductive Adhesive can be used for gap-filling and bonding between high-performance chips, high-power transistors, thermistors, temperature sensors, and power supply modules (such as copper and aluminum heat sinks), preventing heat from accumulating and exposing electronic components to prolonged high temperatures.

2. LED Lighting: Thermally Conductive Adhesive can be applied in the thermal bonding of high-power LED components, LED display backlight tubes, and other LED lighting products, improving heat dissipation and extending service life.

3. Power Modules: Thermally Conductive Adhesive is suitable for thermal bonding applications in power supplies and power devices for photovoltaics, electric vehicles, machinery, etc., ensuring the stable operation of power modules.

4. Heat Sink Fixation: Thermally Conductive Adhesive can be used for thermal bonding between CPU heat sinks, thyristors, wafers, and heat sinks, enhancing heat dissipation efficiency and ensuring stable equipment operation.

5. Other Fields: Thermally Conductive Adhesive can also be utilized in thermal bonding applications for optical components, industrial control computers, lithium batteries, and other fields, meeting the demands of various complex working conditions.

In summary, Thermally Conductive Adhesive plays a crucial role in fields such as electronics, electrical appliances, automobiles, aerospace, and more, due to its unique properties and wide range of applications.