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What are the advantages and disadvantages of organic high-temperature adhesives?

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What are the advantages and disadvantages of organic high-temperature adhesives? Organic high-temperature adhesives mainly include phenolic resin, epoxy resin, polyurethane, etc. Their advantages and disadvantages are as follows:
Advantages:
1. High bonding strength
(1) After high-temperature curing, strong chemical bonds are formed between adhesive molecules, greatly increasing the bonding strength. (2) It has good adhesion to various materials such as metals, ceramics, glass, and plastics, which can meet the bonding needs of different materials.
2. Good chemical corrosion resistance
(1) It can resist the erosion of chemical substances such as acids, alkalis, and salts to a certain extent and maintain stable performance in a complex chemical environment. (2) For some special chemical media, specially treated organic high-temperature adhesives can also show good tolerance.
3. Good processing performance
(1) During use, its viscosity, fluidity and other properties can be adjusted according to needs to adapt to different construction processes and bonding requirements. (2) It can be constructed by various methods such as spraying, brushing, and impregnation, which is convenient to operate.

Disadvantages:
1. Relatively high price
 (1) Due to its high raw material cost and relatively complex production process, the price of organic high-temperature adhesives is usually higher than that of ordinary adhesives. (2) In some application fields with high cost requirements, its use may be limited.
2. Limited high-temperature resistance
(1) Although organic high-temperature adhesives have good performance within a certain temperature range, compared with inorganic high-temperature adhesives, their high-temperature resistance still has certain limitations. (2) At extremely high temperatures, organic high-temperature adhesives may soften, decompose, etc., affecting their bonding effect and service life.
3. Relatively large brittleness
(1) Some organic high-temperature adhesives, such as phenolic resin, have relatively large brittleness and poor impact resistance. When subjected to external impact, it is easy to break. (2) This may affect its use in some application scenarios with high toughness requirements.

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