II. Inorganic high-temperature curing adhesives Silicate:
Silicate adhesives have extremely excellent high-temperature resistance and can be used for a long time at temperatures ranging from 800°C to 1200°C or even higher.
Its main components are sodium silicate, potassium silicate, etc. At high temperatures, it forms a solid ceramic-like structure and has high heat resistance and chemical stability.
The disadvantage is that it is relatively brittle and has high requirements for the surface of the bonded material.
Phosphate:
Phosphate adhesives also have strong high-temperature resistance and can be used within the temperature range of 500°C to 1000°C.
Phosphate adhesives will form stable chemical bonds during the curing process and have good heat resistance and corrosion resistance.
The disadvantage is that the curing time is relatively long and the bonding strength is relatively low.
In conclusion, inorganic high-temperature curing adhesives generally have higher high-temperature resistance than organic high-temperature curing adhesives. However, in practical applications, it is necessary to select a suitable high-temperature curing adhesive according to specific usage requirements and the characteristics of the bonded material.