High-temperature curing adhesives are mainly divided into organic high-temperature curing adhesives and inorganic high-temperature curing adhesives. There are the following differences in high-temperature resistance between them:

I. Organic high-temperature curing adhesives
1. Phenolic resin: - Phenolic resin adhesives have better stability at high temperatures. Generally speaking, phenolic resins can be used for a long time within the temperature range of 200°C to 300°C. - After special treatment, the high-temperature resistance of phenolic resin adhesives can be further improved and may reach a higher temperature, but usually it is also below 500°C. - Advantages: high bonding strength and good adhesion to various materials. Disadvantages: relatively large brittleness and poor impact resistance.

2. Epoxy resin: - The high-temperature resistance of ordinary epoxy resin adhesives is relatively weak, and it is more appropriate to use at temperatures below 150°C. - Modified high-temperature-resistant epoxy resins can work within the temperature range of 200°C to 250°C. Some high-performance epoxy resins can even be used for a short time at higher temperatures. - Advantages: good bonding performance, electrical insulation and chemical corrosion resistance. Disadvantages: Softening and decomposition may occur at high temperatures.

3. Polyurethane: - The high-temperature resistance of polyurethane adhesives is generally around 120°C. Some special polyurethane adhesives can be used at temperatures ranging from 150°C to 200°C. - Advantages: good flexibility and strong adhesion adaptability to various materials. Disadvantages: relatively low high-temperature resistance and prone to aging and degradation at high temperatures.