Product Features:

1. Promote the bonding of addition-type liquid silicone rubber to inorganic and organic substrates;

2. Within the reasonable addition range, it will not affect the curing speed and thixotropy of liquid silicone rubber;

3. Bonding base materials: 304 stainless steel, aluminum alloy, high-density ceramics, silver, ABS, PA, PET, PP, etc.;

4. Suitable for low temperature and room temperature curing.

The main application:

Thermal conductive silicone rubber, LED encapsulation glue, electronic potting glue.

Product indicators:

Precautions:

1. The product should be stored in a dry and cool place, and sealed to avoid moisture.

2. During using process, the operation environment should be dry, and contact with metal compounds containing nitrogen, phosphorus, sulfur, polyvinyl, peroxide, lead, tin, cadmium and other metal compounds is prohibited throughout the process, to avoid uncomplete curing.

3. Avoid directing contact with skin and eyes; operators should wear appropriate protective clothing, protective gloves and masks. If it adheres to the skin, wipe it dry with a dry cloth and rinse with water; if it comes in contact with the eyes, rinse with plenty of water for more than 15 minutes. If the symptoms cannot be relieved, seek medical treatment.

Packaging, storage and transportation:

1.    Packed in a 25L plastic drum, other packages can be customized.

2.    Store in a cool, ventilated and dry place.

3.    The shelf life is 6 months (unopened).

4.    Transported as non-hazardous chemicals.