King of Ultra-high Temperature Bonding: IOTA H21400 Borosilazane Adhesive
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In extreme high-temperature working conditions, bonding failure is a critical risk in industrial manufacturing. The IOTA H21400 Borosilazane Adhesive is specially developed for ultra-high temperature scenarios of 1300–1500°C. Delivering robust performance beyond limits, it is the top choice for high-temperature bonding and sealing.
It features a solvent-free, two-component formula. The gray adhesive has a moderate viscosity (3000–4000cp) for easy application. It cures at a medium temperature (170°C for 2 hours) and exhibits exceptional performance post-curing: room-temperature bond strength >5MPa, compressive shear strength >8MPa at 400–1000°C, and strong adhesion >2MPa even at 1500°C. It resists softening and debonding at extreme temperatures.
Ideal for bonding metals, ceramics, composites and graphite, it also formulates high-temperature resistant coatings. Available in 0.5L–10L drums with custom options, it is a reliable solution for aerospace and high-temperature industrial equipment.