IOTA H21500 is a two-component, solvent-free polycarbosilane adhesive with medium-temperature fast curing. It cures fully in 2 hours at 220℃ and offers excellent heat resistance over 1500℃, suitable for extreme conditions such as aerospace, industrial furnaces and high-temperature kilns. Gray paste with viscosity of 3000–4000cps, providing outstanding bonding strength to graphite, metals, ceramics and composite materials. Room-temperature bond strength >10MPa; compressive shear strength >15MPa at 500–1000℃, and >10MPa even at 1400℃, stable and non-pulverizing at high temperatures. Ideal for high-temperature structural bonding, sealing and refractory coating preparation. Packaging customizable from 0.5L to 10L; 1-year shelf life in cool and dry storage. A reliable bonding solution for ultra-high-temperature equipment.