IOTA H21500: A Hardcore Choice for Bonding and Sealing in Ultra-High Temperature Environments
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IOTA H21500 polysilane adhesive boasts a temperature resistance of over 1500℃, making it an ideal pick for high-temperature working conditions! It features a solvent-free, grey two-component design and can be cured at a moderate temperature of 220℃ in just 2 hours for maximum efficiency. For graphite material bonding, it maintains high strength from room temperature up to 1400℃, with a shear strength under pressure exceeding 15MPa at 500-900℃, ensuring stable bonding force at high temperatures. It enables firm bonding and sealing between metals, ceramics and composite materials, and can also be used to prepare high-temperature resistant coatings, adapting to various industrial production scenarios. Custom packaging from 0.5L to 10L is available, with a 1-year shelf life when stored in a cool and dry place, guaranteeing stable quality.