In the field of industrial bonding and sealing, performance stability under high-temperature working conditions is a core consideration for adhesives. IOTA H21600 Polycarbosilane Adhesive has become the preferred product for high-temperature operation scenarios by virtue of the convenience of medium-temperature curing and excellent high-temperature bonding performance. This adhesive features a solvent-free, gray two-component design, consisting of Component A (base adhesive) and Component B (filler), with a flexible mixing ratio of 1:1.5~2 for A to B and a stable viscosity of 3000~4000 cp. It is easy to control during construction, free from the hidden danger of solvent volatilization, and balances construction convenience with environmental protection. Adopting a medium-temperature curing process, it only requires a curing temperature of 170~200℃ with a short curing time, which can effectively improve production efficiency and reduce working hour losses. In terms of core bonding performance, IOTA H21600 delivers outstanding results. For the bonding of quartz materials, its room-temperature bonding strength can exceed 10 MPa; even after high-temperature aging at 1000℃ for 15 minutes, the room-temperature compressive shear strength remains above 10 MPa. It still maintains strong bonding force after high-temperature exposure, and its high temperature resistance and performance stability far surpass ordinary adhesives, perfectly adapting to bonding requirements in high-temperature environments.