As high-end manufacturing imposes increasingly stringent performance requirements on adhesive materials, IOTA H21600 polycarbosilane adhesive emerges at the right moment. Boasting core advantages of medium-temperature curing and excellent heat resistance, it offers a brand-new technical solution for bonding and sealing of multi-substrate materials.
This solvent-free product features a two-component grey formulation, consisting of Component A (base adhesive) and Component B (filler), which can be used after mixing at a ratio of 1:1.5~2 for easy operation. With its viscosity controlled at 3000~4000cp, it achieves a balanced fluidity and wettability to adapt to various processes. In terms of core performance, its bonding strength for quartz materials exceeds 10MPa at room temperature, and the room-temperature compressive shear strength still remains above 10MPa after aging at 1000℃ for 15 minutes, delivering outstanding performance under high-temperature working conditions.
Moreover, it adopts medium-temperature curing at 170~200℃ with a short curing time, greatly reducing production energy consumption and equipment requirements. The solvent-free formula also ensures environmental protection and production safety. Sealed and stored in a cool place, the product has a shelf life of 1 year, and can be packaged in 0.5L~10L plastic barrels according to customer needs, suitable for both small-scale trials and large-scale production. The launch of this adhesive fills the technical gap of combining medium-temperature curing with ultra-high temperature resistance, providing a reliable option for high-temperature resistant bonding in aerospace, high-end equipment manufacturing and other fields.