Looking for a thermal conductive bonding material suitable for multiple scenarios? The one-component addition-cure IOTA 69445 stands out with all-round performance! It boasts dual application advantages of stencil printing and dispensing, with low BLT characteristics for easier construction. Featuring a thermal conductivity of 2.5 W/m·K and a low thermal resistance change rate, it maximizes heat dissipation efficiency. Rapidly curing in 30 minutes at 150°C, it achieves strong and tough bonding with a hardness of 75±5 Shore A and a shear strength of 2.2 MPa, while its flexible design adapts to complex working conditions. Presented in a gray microfluidic state, it balances practicality and stability with a density of 3.0 g/cm³. Widely used in bonding plastic housings and aluminum plates of automotive electronics, thermal conductive fixing of MOSFETs, lamination of heating elements, and housing bonding/sealing, it delivers a worry-free and reliable thermal conductive bonding solution for the electronics, automotive, and other industries!