Still troubled by poor heat dissipation and weak bonding of electronic components? IOTA 69316 condensation-type one-component thermal conductive adhesive material makes a grand debut, becoming the preferred choice in the industry with its outstanding performance!
This silicone thermal conductive adhesive excels remarkably. Boasting a thermal conductivity of 0.82W/m.K for efficient heat transfer, a density of 1.65g/cm³, and a hardness of 50±5 Shore, it balances firm bonding and heat dissipation needs. The one-component neutral dealcoholization formula enables convenient moisture-curing, with a surface-drying time of 2-4 minutes that greatly improves construction efficiency. Its semi-fluid state suits various gap-filling scenarios.
From LED lighting sealing and heat dissipation of automotive electronic components to positioning and sealing of PCB boards, as well as gap filling between high-power triodes, thyristor diodes and substrates (aluminum, copper), it performs flawlessly. Enhanced by titanium catalysis technology, it offers stable and reliable performance, building a solid heat dissipation barrier for various electronic devices and extending their service life.
With hassle-free construction, powerful heat dissipation, and strong bonding, IOTA 69316 simplifies the operation and maintenance of electronic devices, making it an indispensable assistant in the electronic manufacturing field!