Still troubled by heat dissipation and sealing issues of electronic components? IOTA 69317 condensation-curing single-component thermally conductive adhesive material, based on silicone, provides reliable solutions for multiple scenarios!
It features a thermal conductivity of 1.5W/m·K, combined with a titanium-catalyzed, formic acid-release formula, ensuring stable heat dissipation efficiency. With a thermal conductivity of 1.5W/m·K, it can quickly conduct heat away, preventing components from being damaged by high temperatures. Moreover, it adopts a single-component neutral alcohol-release design, which cures upon moisture absorption. In paste form, it is easy to operate, with a fast tack-free time of 5-10 minutes. Boasting a high density of 2.4g/cm³ and a hardness of 65±5 Shore, it adheres tightly to substrates after curing, delivering excellent sealing, leak-proofing, and anti-aging performance.
Whether for sealing LED lighting fixtures to ensure stable light emission, dissipating heat from automotive electronic components to adapt to complex on-vehicle working conditions, or filling gaps between PCB boards, high-power triodes, thyristor diodes and aluminum/copper substrates—it fits accurately, integrating heat conduction, adhesion and sealing functions to support long-term stable operation of equipment!