In fields like automotive electronics and power devices, the dual requirements of heat dissipation and bonding often pose headaches for engineers. IOTA 69550 addition-curing single-component thermally conductive adhesive material breaks through with multi-dimensional advantages, becoming a new choice in the industry!
It combines efficient construction and reliable performance: it supports stencil printing or dispensing, suitable for automated production; it can quickly cure and form at 150℃ in 30 minutes. With a thermal conductivity of 2.2 W/(m·K) and a low thermal resistance change rate, it ensures stable heat transfer and safeguards the long-term operation of components. Meanwhile, a hardness of 75±10 Shore A provides excellent flexibility, and an Al-Al shear strength of 3.2 MPa achieves the dual protection of strong adhesion and vibration resistance.
From the tight bonding between plastic housings of automotive electronic components and aluminum plates, to the fixed heat dissipation of heating MOS tubes and wafers, and further to the sealing and protection of machine housings, IOTA 69550 fully meets the needs of multiple scenarios and contributes to the reliability upgrade of electronic equipment!