In the fields of precision manufacturing such as electronics and new energy, the dual demands for thermal conductivity and bonding have become increasingly stringent. Against this backdrop, IOTA 69550 addition-cure one-component thermal conductive adhesive material has emerged as a new choice for the industry.
Leveraging the advantages of its addition-cure formula, this material produces no by-products during curing, making it environmentally friendly and suitable for precision scenarios. The one-component design simplifies the construction process—no mixing or proportioning is required, significantly improving production efficiency. Its excellent thermal conductivity enables rapid heat transfer, ensuring the stable operation of equipment such as electronic components and battery modules while extending their service life.
With strong bonding capability, it can firmly adhere to various substrates, and also features good weather resistance and chemical stability, adapting to complex working conditions. Whether for electronic device packaging, thermal conductive bonding of new energy batteries, or heat dissipation and fixation of precision instruments, IOTA 69550 can accurately meet the needs, helping enterprises break through manufacturing bottlenecks and enhance the core competitiveness of their products.