A New Benchmark for High-Temperature Bonding! IOTA R3800 Siloxynitride Adhesive Makes a Grand Debut
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Still troubled by bonding challenges in high-temperature scenarios? The IOTA R3800 siloxynitride adhesive is here to tackle industry pain points with outstanding performance!
This gray-black solvent-free adhesive features a three-component design and cures at room temperature. With a 30-minute working time and a complete curing cycle of 5-7 days, it enables convenient and efficient construction. Boasting a viscosity of 8000cp, it adapts to various application needs. After curing, it offers both good toughness and reliable adhesion—its room-temperature lap shear strength exceeds 2.5MPa, remaining above 1.3MPa even at 400℃ and maintaining stable performance at over 1MPa in extreme 600℃ environments.
What’s more impressive is its excellent high-temperature stability: weight loss is less than 10% after holding at 600℃ in a nitrogen atmosphere for 10 minutes. Withstanding 600-800℃, it is widely suitable for bonding and sealing metals, ceramics, and composite materials, as well as preparing high-temperature resistant coatings.
Customizable packaging from 0.5L to 10L meets diverse dosage requirements. The 1.5-year shelf life of the base adhesive and 1-year shelf life of the curing agent enhance practicality. Under sealed, low-temperature storage, the opened curing agent can be used for over 8 months. Simply operate in a well-ventilated environment to avoid ammonia emission. Choose IOTA R3800 for industrial high-temperature bonding—stable, reliable, and worry-free!