1. Temperature resistance：The use range of inorganic high-temperature adhesives is 1500-1750℃, and that of copper phosphate oxide adhesives is 180-1400℃. Due to the high cost of zircon sand and refractory clay, it is necessary to find cheap substitutes to reduce costs. Modified organic adhesives such as B4C modified phenolic resin adhesive can withstand 1500℃, with growing market demand and broad prospects.

2. Low pollution：Environmental awareness is increasing, and environmentally friendly adhesives are becoming a trend. Polyethylene formaldehyde adhesives ("107 glue") containing free formaldehyde are banned in developed countries, and their use in my country is also decreasing, and will be eliminated. It is an inevitable trend to modify non-environmentally friendly adhesives to be environmentally friendly.

3. Non-destructive bonding：The bonding technology avoids the damage and stress concentration of materials by bolt connections and other methods. The bonding interface bears the load as a whole, improving the load capacity and life.

4. Lightweight：The density of adhesive is low (0.9-2), which is only 20%-25% of metal or inorganic materials, which significantly reduces the weight of the connecting materials. It is suitable for aerospace, aviation, missiles, automobiles, navigation and other fields, and has important significance for weight reduction and energy saving.

silicone adhesive products are as follows:Products-IOTA (siliconeadhesives.net)