New Choice for Efficient Thermal Conductivity and Bonding, Empowering Stable Operation of Equipment in Multiple Fields As electronic devices become more integrated and power-dense, the dual demand for heat dissipation and bonding has emerged as a key industry pain point. This addition-cure one-component thermal conductive adhesive material, made from imported silicone and high-quality thermal conductive fillers, provides a reliable solution for multi-scenario applications. It combines excellent thermal conductivity and bonding strength, effectively filling gaps between components, avoiding performance degradation caused by heat accumulation, and significantly extending equipment service life. The product supports room-temperature curing with fast surface drying, allowing manual or mechanical dispensing. It is easy to operate and non-sagging, adapting to large-scale production needs. With a wide temperature resistance range of -50℃ to 260℃ and excellent resistance to thermal shock, this material performs outstandingly in fields such as LED lighting, automotive electronics, and power modules. Meanwhile, it complies with the ROHS directive, being solvent-free and non-corrosive, friendly to various substrates. It also features moisture-proof, insulating, shock-absorbing and buffering properties, building a solid safety barrier for precision electronic equipment.