Curing pressure plays a crucial role in adhesive bonding, with multiple core benefits. It facilitates full wetting of the surface by the adhesive, ensuring tight contact with the substrate. It helps expel low-molecular volatiles generated during the adhesive's curing reaction, reducing defects in the bond layer. It also removes residual volatile solvents in the adhesive layer, enhancing bonding stability. Additionally, it enables precise control of the adhesive layer thickness—high-viscosity adhesives tend to form thicker layers, and adjusting curing pressure can keep the thickness within the desired range. After applying the adhesive, a period of standing is required, known as pre-curing. Once the adhesive viscosity increases, pressure is applied to ensure uniform thickness of the adhesive layer.