In fields such as automotive electronics and semiconductors, the needs for thermal conduction and bonding of components often coexist. It is necessary to not only ensure efficient heat transfer but also achieve firm bonding of parts. IOTA 69445 Addition-Cure One-Component Thermally Conductive Adhesive Material can precisely meet the requirements of such scenarios.
As a one-component material, it requires no complex proportioning and can be directly applied through stencil printing or dispensing processes. It is compatible with automated production workflows, greatly reducing operational difficulty. Its core advantage lies in the integration of two functions: "thermal conduction + bonding". With a thermal conductivity of 2.5W/m·K, it can quickly dissipate heat from heat-generating components. Moreover, its low thermal resistance change rate ensures stable thermal conductivity during long-term use. It has excellent adhesion to substrates like aluminum, with an Al/Al shear strength of 2.2MPa. After curing, its hardness reaches Shore A 75±5, which combines toughness and stability to prevent components from falling off in vibrating environments.
It also performs outstandingly in terms of curing efficiency. It can complete curing and form effective bonding in 30 minutes at 150℃, meeting the production cycle requirements of the automotive electronics industry. Whether it is for bonding plastic housings of automotive electronic components to aluminum plates, thermally conductive fixing of heat-generating elements such as MOSFETs, or wafer bonding and housing sealing, IOTA 69445 can provide reliable support for the stable operation of equipment with an integrated solution, making it a thermal conductive bonding choice that balances efficiency and performance.