IOTA 68210 is an addition-curing two-component thermal conductive adhesive material, featuring low viscosity, high fluidity, excellent thermal conductivity, low thermal resistance, and fast curing. It has a thermal conductivity of 0.7W/m·K, a viscosity of 4000±500mPa·s, a density of 1.60±0.05g/cm³, a working time of 40-80 minutes, a hardness of Shore A 50±5 after curing, and a shear strength of 0.6MPa for aluminum-aluminum substrates.
This product needs to be mixed at a 1:1 ratio. After curing, it shows medium-low hardness, has adhesion to most substrates at room temperature, and boasts high temperature resistance and excellent thermal stability. It can be widely used for potting and bonding in scenarios such as automotive electronic modules, sensor components, photovoltaic junction boxes, inverters, electric vehicle OBC modules, and lithium battery packs.