In electronics manufacturing, commonly used adhesives include epoxy resin, UV (ultraviolet) glue, hot-melt adhesive, solder paste, anaerobic adhesive, and two-component adhesive, etc. Epoxy resin is generally cured at high temperatures. After curing, it has strong adhesive force and is widely used in the bonding of functional devices, underfill processes, etc. UV glue is cured by ultraviolet light. It has the advantages of less pollution and fast curing, and is most widely used in some encapsulation dispensing, surface dispensing and other fields.
In chip packaging, die bonding glue has requirements for the adhesive's bonding ability, thermal conductivity, thermal resistance, etc., especially in LED chip packaging. Hot-melt adhesive is a structural PUR glue, which has the characteristics of low-temperature natural moisture vapor curing, fast curing, non-toxic and pollution-free. Due to its unique advantages, it is gradually replacing other types of glues.