Potting is a core application field of epoxy resin, widely used in the electronic device manufacturing industry, and serves as an indispensable insulating material in electronics. The process involves pouring liquid epoxy resin composites into devices containing electronic components and circuits by mechanical or manual means, which then cure into thermosetting polymer insulating materials at room temperature or with heating.

Potting functions to: strengthen the integrity of electronic devices, enhancing resistance to external impacts and vibrations; improve insulation between internal components and circuits, facilitating miniaturization and lightweight design; and prevent direct exposure of components and circuits, enhancing the device's waterproof and moisture-proof performance. Epoxy potting adhesives come in various types, classified by curing conditions into room-temperature curing and heat-curing types, and by formulation into two-component and one-component types. Room-temperature curing types are mostly two-component, requiring no heating but with limited processability, suitable for low-voltage devices or scenarios where heating is inappropriate. Two-component heat-curing products are the most widely used, featuring low viscosity, good impregnability, and excellent comprehensive properties, suitable for automated production of high-voltage devices. In recent years, foreign developers have also introduced one-component heat-curing types, which require simple equipment and are easy to use.