Printed circuit boards, whether rigid or flexible, cannot do without adhesives.

For epoxy-glass boards, acetal-phenolic, nitrile-phenolic, or modified epoxy adhesives can be used, with a maximum service temperature of approximately 150°C. When used at high temperatures of 260°C, glass-silicone laminates or copper/PTFE composite boards should be employed.

The stack assembly of rigid printed circuit boards can be bonded together using plastic films coated with thermoplastic or thermosetting adhesives.

In some cases, complex assemblies require thin, flexible printed circuits. Applying RTV silicone rubber coatings in such scenarios not only serves as an insulating layer but also provides vibration damping, as vibration can add undesirable fatigue loads to solder joints.

Additionally, applying epoxy and silicone adhesives to stressed components can reduce the impact of shock and vibration.