COB/COG/COF Electronic Adhesives
COB/COG/COF electronic adhesivesare high-quality single-component epoxy encapsulation adhesives. They possess excellent solder resistance, moisture resistance, temperature cycling performance, and good fluidity. With a low coefficient of thermal expansion, they can reduce deformation and are suitable for electronic products such as LCDs, PDAs, and calculators. After curing, they also feature excellent performance characteristics such as low shrinkage, low moisture absorption, flame retardancy, and bending resistance, and are particularly suitable for IC bonding and providing protection for it.
MC/CA/LE/EP Encapsulation Materials
MC/CA/LE/EP encapsulation materials are what we commonly refer to as conductive silver adhesives. They are a type of single-component, thermally curable, high-purity, low-impedance, and low-modulus epoxy adhesive. They can be used for conductive bonding in electronic devices, chip mounting, etc., and can partially replace traditional conductive methods such as silver sintering, soldering, and wire connection.
BGA/CSP/WLP Electronic Adhesives
BGA/CSP/WLP electronic adhesives are what we commonly call underfill adhesives. They are often used for underfilling at the bottom of CSP or BGA. The underfill layer formed by them can effectively reduce the problem of thermal expansion mismatch between the chip and the substrate. The underfill adhesive has a fast curing speed, low viscosity, and good room-temperature fluidity. It is suitable for the underfill protection of CSP components with medium and extremely small gaps and is convenient for rework. It has excellent mechanical and anti-aging shock resistance performance, can provide excellent protection against mechanical shock and anti-aging shock for BGA or CSP components, and meets the requirements of automated production.
Potting Adhesives
Potting adhesives are usually in a liquid state and have fluidity before curing. After curing, they can play roles such as moisture-proofing, waterproofing, and anti-corrosion to improve the stability and service life of products. According to their materials, they can be divided into epoxy potting adhesives, silicone potting adhesives, and polyurethane potting adhesives. According to their usage requirements and product characteristics, they can be potted manually or by machine, and are mainly used for the potting of electronic components, modules, transformers, power supplies, sensors, and other electronic assemblies.
Thermal Conductive Adhesives
Thermal conductive adhesives can be said to be specially produced for design schemes that utilize gaps to transfer heat. They can fill the gaps, complete the heat transfer between the heat-generating part and the heat-dissipating part, and at the same time play roles such as insulation, shock absorption, and sealing. They are often used in components with large heat generation and heat dissipation requirements, such as transformers, transistors, and CPU chips.