The differences in operation processes and applications between addition-curing silicone adhesives and condensation-curing silicone adhesives.
Hits: 650 img
Application Scenarios
Addition-type
Electronic Encapsulation: It is used for the encapsulation and potting of electronic components, such as integrated circuits, chips, etc. It can protect electronic components from the influence of the external environment and ensure the stability of their performance.
Optical Field: Due to its high transparency and low shrinkage rate, it is suitable for the bonding of optical lenses, the encapsulation of optical modules, etc., and will not have a great impact on the optical performance.
High-end Manufacturing Industry: In the fields of aerospace, automotive manufacturing, etc., it is used for the bonding and sealing of structural parts, which can meet the requirements of high strength and high reliability.
Condensation-type
Building Sealing: It is often used for the sealing of building curtain walls and doors and windows, which can effectively prevent the penetration of rainwater and air and adapt to the expansion and contraction deformation of building materials.
Home Decoration: Such as the sealant for parts like bathrooms and kitchens, it has good water resistance and mildew resistance and can play the roles of sealing and waterproofing.
General Industrial Bonding: It is more suitable for some bonding occasions where the strength requirement is not particularly high but softness and good weather resistance are needed, such as the bonding of plastic and rubber products.
Operation Process
Addition-type
Mixing Ratio: Usually, the A and B components need to be mixed strictly according to a specific ratio to ensure the full progress of the curing reaction and the stability of the performance.
Operation Time: There is a certain operation time. Operations such as gluing and assembling can be carried out within this time. However, the adhesive will start to cure after the operation time, so attention needs to be paid to control.
Curing Conditions: Generally, it needs to be cured under certain temperature and humidity conditions, and the requirements for the environment are relatively high. Some products may require heating for curing.
Condensation-type
Mixing Method: Some single-component products of the condensation type do not need to be mixed and can be used directly, and the operation is relatively simple; for two-component products, the requirements for the mixing ratio are relatively not so strict.
Operation Time: The operation time is relatively long, which is suitable for some complex bonding or sealing operations, but it also needs to be noted that the curing should be completed within an appropriate time.
Curing Conditions: It has certain requirements for environmental humidity, and the curing effect is better in an environment with appropriate humidity. Generally, it can be cured at room temperature without additional heating.