The addition - cure two - component silicone thermal conductive adhesive is mainly composed of two components: the vinyl - containing polysiloxane base polymer and the hydrogen - containing polysiloxane curing agent. When these two components are mixed in a specific ratio, under the action of a platinum catalyst, a hydrosilylation reaction occurs between the vinyl group and the hydrogen group. Different from the condensation - type two - component adhesive, no small - molecule by - products are generated during this reaction process, and a more regular and dense three - dimensional cross - linked network structure can be constructed. This unique chemical structure endows the adhesive with a series of excellent properties, laying a solid foundation for its stable application in harsh industrial environments.
Excellent Performance Creates Industry - Leading Advantages
(I) Ultra - high Thermal Conductivity Ensures Efficient Equipment Operation
In fields with extremely strict requirements for heat dissipation, such as electronics and energy, the addition - cure two - component silicone thermal conductive adhesive shows extraordinary thermal conductivity. By adding high - purity fillers with high thermal conductivity coefficients, such as aluminum nitride and silicon carbide, and using advanced dispersion techniques to make them evenly distributed in the polymer matrix, the adhesive can build an extremely efficient heat conduction channel. Its thermal conductivity coefficient can easily exceed 3.0W/(m·K), and some high - performance products can even reach above 5.0W/(m·K), which is a significant improvement compared with similar condensation - type two - component products. This excellent thermal conductivity can quickly transfer a large amount of heat generated during equipment operation, effectively avoiding performance degradation and failures caused by overheating, and ensuring that the equipment can still maintain a stable and efficient working state under high - load and long - term operation.
(II) Strong Bonding Strength Adapts to the Connection of Diverse Materials
Whether they are rigid materials such as metals and ceramics, or flexible materials such as plastics and rubbers, the addition - cure two - component silicone thermal conductive adhesive can achieve high - strength and long - lasting stable bonding. During the curing process, the chemical bonding formed by the hydrosilylation reaction and the physical adsorption between molecules work together to generate a firm adhesion force on the surface of the adherend. Even in the face of severe temperature changes, mechanical vibrations, and chemical corrosion and other harsh working conditions, the bonding joint remains as solid as a rock, being able to provide reliable structural support for the product and ensuring the structural integrity and stability of the product in a complex environment.
(III) Excellent Weather Resistance and Chemical Stability Broaden the Application Boundaries
The silicone chemical structure endows the addition - cure two - component silicone thermal conductive adhesive with excellent weather resistance and chemical stability. When exposed to harsh environmental factors such as ultraviolet rays, ozone, high and low temperature cycles, and acids, alkalis, and organic solvents for a long time, the adhesive can always maintain stable performance without yellowing, embrittlement, degradation and other aging phenomena. Compared with condensation - type products, its stability in extreme environments is more prominent, which makes it show excellent applicability in fields with extremely high requirements for material durability, such as outdoor facilities, marine engineering, chemical equipment, and aerospace, greatly broadening its application scope.
(IV) Precise and Controllable Curing Characteristics Improve Production Efficiency
During the use of the addition - cure two - component adhesive, users can accurately adjust parameters such as the mixing ratio of the two components, the amount of catalyst, and the curing temperature and time according to actual production needs, achieving precise control over the curing speed and operation time of the adhesive. When carrying out large - area and complex - structure bonding construction, the operation time can be appropriately extended to ensure that the adhesive can fully infiltrate and fill the fine pores on the surface of the adherend to achieve a perfect fit; while in the assembly line operation with high requirements for production efficiency, the curing speed can be significantly accelerated by optimizing the curing conditions, greatly shortening the production cycle and improving production efficiency to meet the diverse needs of different production scenarios.
IOTA 68210 addition two-component thermally conductive adhesive material-Silicone Adhesive
