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Temperature Resistance
Inorganic high-temperature adhesives are usually used within the temperature range of 1500-1750°C. The copper oxide phosphate adhesive has a wider temperature resistance range and can be used within the range of 180-1400°C. However, the main aggregates used in inorganic high-temperature adhesives are zircon sand, refractory clay. Zircon sand is of high price and mainly depends on import. Obtaining refractory clay requires sacrificing land, which comes at a great cost. Therefore, it is an urgent task to find inexpensive and easily available products to replace the traditional aggregates in order to reduce production costs. Some organic adhesives have also achieved high-temperature resistance through modification. For example, the phenolic resin adhesive modified with B4C can withstand a high temperature of 1500°C. The market demand for temperature-resistant adhesives is constantly increasing, so this type of adhesive has broad development prospects.
Low Pollution
With the increasingly serious deterioration of the global environment, people have gradually started to use some environmentally friendly products. Although adhesives are not a large category of chemical products, their harm to the environment cannot be ignored. Those non-environmentally friendly adhesives will gradually be abandoned. Polyvinyl formal adhesive (commonly known as "107 glue") contains free formaldehyde, which is harmful to human health. It has long been banned in developed countries. However, due to its low price in China, it still has a considerable market share at present. But its usage has been gradually decreasing and it will be completely phased out soon. It is an inevitable task to transform non-environmentally friendly adhesives into environmentally friendly ones through modification.
Non-destructive Bonding
The connections of materials mainly include bolt connection, riveting, welding and bonding, etc. Although technologies such as bolt connection can achieve rapid connection, they will damage the materials due to drilling holes in the material parts or local heating, and stress concentration cannot be avoided during use. In contrast, the bonding technology is a non-destructive connection technology. Since the bonding interface bears the load as a whole, it can improve the load-bearing capacity and extend the service life.
Lightness
The density of adhesives is relatively small, mostly between 0.9 and 2, which is about 20%-25% of the density of metals or inorganic materials. Therefore, it can greatly reduce the weight of the connecting materials of the bonded objects. This has important value in reducing the self-weight and saving energy in aerospace, aviation, missiles, and even in automobiles and navigation.
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